Assembly Engineer

Company Overview:MACOM designs and manufactures semiconductor products for Data Center, Telecommunication, and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe, and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs, and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. https://www.macom.com/. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives, and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

Assembly Engineer

Job Description:

• Support new product introductions from concept through production release, providing critical mechanical design input for RF power and photonics products.
• Develop mechanical/manufacturing solutions for module and enclosure, focusing on cost, volume manufacturability, yield, and quality.
  Collaborate with internal design, QA, reliability, supply chain, and external suppliers to qualify new equipment, technologies and assembly processes.
• Plan and establish engineering build requirements for new product introductions.
• Perform design reviews to ensure adherence to DFM guidelines and update design rules as required.
• Create and maintain mechanical design drawings, specifications, and 3D models using SolidWorks and AutoCAD.
• Generate technical documentation, including design reports, test reports, datasheets, and bills of materials.
• Develops, implements and maintains methods, operation sequence and processes in the assembly manufacturing.
• Maintains records such as yield report and reporting system for coordination of manufacturing operations.
• Drive improvement in terms of yield and cost saving.
• Interface with design engineering team in coordinating the release of new products.
• Responsible for documentation management and an understanding of good manufacturing practices. Uses appropriate tools and performs integrity analysis of packaging.
• Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
• Implement and improve robust assembly processes internally and at our contract manufacturers

Job Qualifications:

• min. Bachelor Degree in Engineering.
• 1-5 years of experience in mechanical design, preferably in semiconductor or electronics packaging.
• Mature, highly responsible, a good team player with good presentation skills
• Fluentin spoken and written English. Must be US person
• Strong analytical, problem-solving, and communication skills.

Other Special Skills:

• Expertise in 2D AutoCAD and 3D SolidWorks (or similar CAD software).
• 3D printing for fast prototyping and design verification combined with good mech skills to build prototypes. (able to handle cutting laser and horizonal mill is a plus).
• Ability to work independently and collaboratively in a fast-paced, result-oriented environment.
• Knowledge of manufacturing technologies for packaging electronics, including machining metals, plastic injection molding, and additive manufacturing (3D printing).
• Strong organizational skills and proficiency in Excel, Word, and PowerPoint.
• Very good common of English, both oral and written
• Familiarity with semiconductor assembly equipment (SMT, die attach, wire bonding, molding) is a plus.
• Experience with SMT and PCB layout design and related software (e.g., Cadence) is a plus.
• Experience with FEA tools (e.g. ANSYS) is a plus.
• Knowledge of thermal management design for electronics is a plus.

Salary RangeThe Salary Range for this position is $69,000 - $113,000. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidates' experience, education, and specific knowledge, skills, and abilities.

EEO:

MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.
Reasonable Accommodation:

MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call +1-978-656-2500 or email HR_Ops@MACOM.com. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.

ITAR
Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Benefits: This position offers a comprehensive benefits package including but not limited to:

• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.