Photonics Mechanical Design Engineer, Senior

Company Overview:

MACOM designs and manufactures semiconductor products for DataCenter, Telecommunication, and Industrial and Defense applications.Headquartered in Lowell, Massachusetts, MACOM has design centers and salesoffices throughout North America, Europe, and Asia. MACOM is certified to theISO9001 international quality standard and ISO14001 environmental managementstandard.

MACOM has more than 65 years of application expertise withmultiple design centers, Si, GaAs, and InP fabrication, manufacturing, assemblyand test, and operational facilities throughout North America, Europe, andAsia. See our website to view our facilities. https://www.macom.com/. In addition, MACOM offers foundry services that represents a key corecompetency within our business.

MACOM sells and distributes products globally via a saleschannel comprised of a direct field sales force, authorized sales representatives,and leading industry distributors. Our sales team is trained across all of ourproducts to give our customers insights into our entire portfolio.

Job Title: Photonics Mechanical Engineer, Senior

Position Overview: Technical lead supporting new product introductions from concept through production release. This individual will provide critical design input to RF and/or photonics product and design engineers for optimum, cost-effective mechanical solutions. This individual may be required to lead multiple product development projects in parallel to deliver opto-mechanical package and enclosure solutions (modules) on schedule for prototyping and manufacturing.

KeyResponsibilities:

• Technical lead for developing mechanical/manufacturing solutions in RF and photonics module and enclosure development.
• Work with internal Product Design, QA, Reliability, Supply chain and external suppliers to develop, apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, manufacturability, yield, and quality.
• Work with Design, Program Management and Material Planning to plan and establish Engineering Build Requirements and Qualification Build Requirements for new product introductions.
• Collaborate with vendors and internal engineering resources to establish and update design rules for packaging.
• Perform design reviews to ensure adherence to DFM guidelines.
• Establish and implement robust assembly processes internally and at contract manufacturers.
• Working with Quality organization, characterize failure modes and analyze as a function of packaging materials and processes. Troubleshoot packaging and assembly defects, then define and implement solutions.
• Design/Develop tooling for high volume, high mix processes.
• Establish application notes for new products.

KeyCompetencies & Skills required:

• Knowledge of high-volume RF and photonics packaging assembly/test processes.

• In depth understanding of a variety of optical networking devices such as lasers, modulators, detectors, WDM, optical fibers, and control electronics.
• Experience in successfully driving design/development/characterization activities from concept to implementation.
• Ability to lead independent process development efforts and provide suppliers direction by working with design, assembly, and quality organizations.
• Experience with solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) and computational fluid dynamics (CFD) software.
• Knowledge of product characterization, testing, quality, and reliability, including compliance testing and certification.
• Experience in process troubleshooting, failure analysis and Six Sigma methodologies.
• Ability to work under tight deadlines, with strong ownership of projects.
• Ability to work effectively in a multi-project mode.
• Good written and verbal communication skills. Able to present ideas, design concepts, data and plans with high confidence at team meetings and business group review meetings.
• Good teamwork skills in working together to achieve goals.
• Experience with AutoCAD and/or SolidWorks is desired.
• Fluent with Microsoft Office products.

RequiredQualifications and Experience:

• MS or BS in Mechanical Engineering or similar studies.
• Minimum of 10 years of experience in relevant design engineering with process development and design/emphasis on electronic assemblies.
• Due to ITARregulations, only candidates who are U.S. Persons (U.S. citizens, U.S.nationals, lawful permanent residents, or individuals granted asylum or refugeestatus) will be considered for this position.
• Must be able to obtain a security clearance.

EEO:

MACOM is an Equal Opportunity Employer committed to a diverseworkforce. MACOM will not discriminate against any worker or job applicant onthe basis of race, color, religion, sex, gender identity, sexual orientation,national origin, age, disability, genetic information, veteran status, militaryservice, marital status, or any other category protected under applicable law.

Reasonable Accommodation:

MACOM is committed to working with and providing reasonableaccommodations to qualified individuals with physical and mental disabilities. Ifyou have a disability and are in need of a reasonable accommodation withrespect to any part of the application process, please call +1-978-656-2500 oremail HR_Ops@MACOM.com. Provide your name, phone number and the position titleand location in which you are interested, and nature of accommodation needed,and we will get back to you. We also work with current employees who request orneed reasonable accommodation in order to perform the essential functions oftheir jobs.