$125,270 - $296,739 yearly
Nokia
New York, NY
Job Description As part of Nokia's Advanced Packaging R&D team, you will be responsible for the mechanical development of next generation, high performance electro-optic modules. You will be responsible for the integration of Silicon Photonics based Coherent optical transceivers within Nokia's Photonic Service Engines, from inception stage to New Product Introduction. Responsibilities Lead Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met. Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets. Drive key technology development to enable next generation product design. Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software. Perform thermal analysis, and coupled-physics involving thermal-structural, thermal-mechanical stress and thermo-electric analyses. Own and maintain...

