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4 structural engineer intern jobs found

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High-Tech structural engineer intern New York
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Wi
Aug 05, 2026
Full time
Engineer II-OSP
$63,400 yearly
Windstream Fulton, NY
Kinetic, a business unit of Uniti (NASDAQ: UNIT), is a premier insurgent provider of multi-gigabit fiber internet, whole-home Wi-Fi, internet security, and voice services in 1,400 markets across 18 states in across the U.S. Additional information about Kinetic is available at www.GoKinetic.com About This Role: Kinetic's team of Outside Plant Engineers connects consumer and small business partners to our leading telecommunications products across the United States. In this role you will work to create meaningful connections with customers and build long-term relationships. By analyzing a variety of data, you will solve complex problems for our business and residential customers utilizing copper cable, fiber cable, and electronics. What You'll Do: Engineer/design outside plant facilities including fiber and copper Assist in the planning, analysis, design and engineering of outside plant network structures and facilities Organize complex activities for the development,...
VT
Aug 05, 2026
Full time
Manufacturing Engineer
$70,000 - $80,000 yearly
VJ Technologies Bohemia, NY
Manufacturing Engineer Overview VJ X-Ray LLC is the global leader in developing and manufacturing integrated x-ray sources and high voltage generators. Our mission is to be uncompromising in pushing the boundaries of component design and manufacturing for every OEM partner. VJ X-Ray is seeking a detail-driven, process-oriented Manufacturing Engineer to make an impact with our engineering change processes, product documentation, and manufacturing support activities. This role sits at the intersection of engineering, operations, and productlifecycle management, ensuring that product data is accurate, controlled, and communicated clearly and concisely across the organization. This position is ideal for someone who excels at documentation, cross-functional coordination, and keeping complex product information organized and flowing smoothly. Essential Skills/Job Duties: A bachelor's degree in mechanical engineering (or closely related field) A minimum of one (1) years'...
No
Aug 05, 2026
Full time
Senior Mechanical Packaging Engineer
$125,270 - $296,739 yearly
Nokia New York, NY
Job Description As part of Nokia's Advanced Packaging R&D team, you will be responsible for the mechanical development of next generation, high performance electro-optic modules. You will be responsible for the integration of Silicon Photonics based Coherent optical transceivers within Nokia's Photonic Service Engines, from inception stage to New Product Introduction. Responsibilities Lead Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met. Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets. Drive key technology development to enable next generation product design. Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software. Perform thermal analysis, and coupled-physics involving thermal-structural, thermal-mechanical stress and thermo-electric analyses. Own and maintain...
TT
Aug 05, 2026
Full time
RF/Microwave Engineer II
$86,706 - $144,510 yearly
TTM Technologies Syracuse, NY
TTM Technologies, Inc. - Publicly Traded US Company, NASDAQ (TTMI) - Top-5 Global Printed Circuit Board Manufacturer About TTM TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com RF microwave engineering responsibilities associated with new product development or internal R&D efforts. These include design efforts ranging from simple RF microwave components to complex microwave assemblies driven by customer or internal specifications. Design includes 3D-simulations, design optimization based on fabrication...
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